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Injection Moulding JEDEC Matrix Tray For Fast Production And Standardized IC Component Handling

Injection Moulding JEDEC Matrix Tray For Fast Production And Standardized IC Component Handling

Marchio: Hiner-pack
Numero di modello: HN24120
MOQ: 500pcs
prezzo: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condizioni di pagamento: 100% Prepayment
Capacità di approvvigionamento: 2000PCS/Day
Informazioni dettagliate
Luogo di origine:
Shenzhen China
Certificazione:
RoHS、ISO
Matrice:
8*18 = 144pcs
Incoterms:
EXW, FOB, CIF, DDU, DDP
Proprietà:
ESD, non ESD
Materiale:
MPPO
Antistatico:
Metodo di stampaggio:
Stampaggio a iniezione
Impilabile:
Packaging Details:
70~100pcs/carton(According To The Customer Demand)
Supply Ability:
2000PCS/Day
Evidenziare:

Injection Moulding JEDEC Matrix Tray

,

Fast Production JEDEC Tray

,

MPPO Material Matrix Tray

Descrizione del prodotto
Anti-Static Injection Moulding for Output and Fast Production
Product Description
JEDEC (Joint Electronic Device Engineering Council) - www.jedec.org - is responsible for creating open standards in the microelectronics industry. These standards ensure product interoperability, benefiting both the industry and consumers by reducing product development time and costs while increasing efficiency and productivity. JEDEC trays all adhere to the same size, standardized outline, and required features.
Placing parts in a JEDEC tray guarantees that your components can be easily processed in industry-standard automation equipment, including pick and place machines, inspection tools, laser marking devices, testing equipment, and dispensing tools. It is simple to integrate commercially available JEDEC tray feeders into custom process machines.
The maximum baking temperature is clearly marked on JEDEC trays. Exceeding this specified temperature during baking can lead to alterations in the tray's dimensions and potentially harm the contents. The tray's maximum temperature rating is determined by the type of molding compound utilized during manufacturing.
Features
  • JEDEC trays are custom designed and manufactured, often device and manufacturer specific
  • Component footprint for PCB layout is more tightly controlled than packaging
  • Off-the-shelf options available for high-demand custom trays
  • Open-tooled custom molds available with minimum quantity requirements
Technical Parameters
Parameter Value
Brand Hiner-pack
Outline Line Size 322.6x135.9x7.62mm
Model HN24120
Cavity Size 15.9*10.3*2.6mm
Material MPPO
Matrix QTY 8*14=112PCS
Package Type IC Component
Flatness MAX 0.76mm
Color Black
Resistance 1.0x10e4-1.0x10e11Ω
Certificate RoHS, IOS
Applications
Packaging: JEDEC trays function as containers with stacking features for efficient storage.
Transportation & Storage: Ideal for safe transport of components locally or internationally.
Protection: Provides mechanical and electrostatic discharge (ESD) protection.
Standardization: Offers compatibility with most semiconductor and PC board manufacturing equipment.