prodotti

Casa / prodotti / Vassoi della matrice di JEDEC /

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Marchio:	Hiner-pack
Numero di modello:	HN23072
MOQ:	500 pezzi
prezzo:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condizioni di pagamento:	100% di pagamento anticipato
Capacità di approvvigionamento:	2000 pezzi/giorno

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine:

Cina

Certificazione:

RoHS、ISO

Matrice:

4×13=52PZ

Resistenza all'umidità:

Fino al 90%

Dimensione della cavità:

21,18x16,08x2,6 mm

Capacità di peso:

Varia, in genere fino a 500 grammi per cavità

Resistenza ai raggi UV:

SÌ

Deformazione:

Meno di 0,76 mm

Riutilizzabilità:

Riutilizzabile

Applicazione:

Gestione, stoccaggio e spedizione dei circuiti integrati

Imballaggi particolari:

70~100pcs/cartone ((Secondo la domanda del cliente)

Capacità di alimentazione:

2000 pezzi/giorno

Descrizione del prodotto

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

This JEDEC-compliant matrix tray is tailored for manufacturers who require high-performance handling solutions in precision electronics environments. Made with static-dissipative material, it delivers essential ESD protection while maintaining structural uniformity during repeated handling cycles.

Its integrated locating and alignment features support fast and accurate positioning on automated lines, while molded pockets ensure secure device containment throughout testing, assembly, and shipment.

Key Features/ Benefits

Fully conforms to JEDEC outline requirements for compatibility with global processing equipment.
Made from conductive materials that provide consistent ESD protection, helping safeguard sensitive components.
Precision-formed cells hold parts securely in fixed orientations, reducing handling errors and device shift.
Designed for compatibility with vacuum pickup tools, mechanical arms, and inline feeding systems.
Withstands operational stress during processing and storage while retaining tray flatness and pocket integrity.
Interlocking edges allow for stable, space-saving stacking, whether in-process or in storage.

Specifications

Brand		Hiner-pack
Model		HN23072
Material		MPPO/PPE
Package Type		BGA,QFP,QFN,LGA,PGA
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		21.18x16.08x2.6mm
Matrix QTY		4×13=52PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These trays are ideal for electronics manufacturing, assembly lines, cleanroom environments, and automated handling systems. Their versatility extends to acrylic tray displays and inventory management applications.

Engineered for IC assembly, automated inspection, and semiconductor testing
Ideal for operations where speed and handling precision are key.
From chip-level packaging to system module assembly—and integrates easily into both inline and batch-process setups.
Ensures reliable positioning and part safety at every stage, in a cleanroom or on a standard production floor.

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges:

• Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.

• Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.

• In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.

• Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tag:

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Standard JEDEC IC Tray For AI semiconductor manufacturing progress

Customization:

Vassoi della matrice di ESD JEDEC

Vassoi della matrice dello SGS JEDEC

Vassoio dello SGS JEDEC

Consiglieri di matrice ESD riutilizzati Consiglieri di spedizione JEDEC IC per dispositivi ottici

Vassoi neri di plastica della matrice dello SGS ESD JEDEC per i prodotti elettronici

Modulo del PWB che imballa temperatura elevata dei vassoi 21PCS della matrice di ESD JEDEC resistente

Anti sensore nano nero corrosivo di JEDEC Tray Suppliers Cycle Loading For

PES Materiale ESD JEDEC Matrice Tray Warpage Meno di 0,76 mm