prodotti

Casa / prodotti / IC Chip Tray /

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

Marchio:	Hiner-pack
Numero di modello:	HN24130
MOQ:	500
prezzo:	TBC
Condizioni di pagamento:	100% Prepayment
Capacità di approvvigionamento:	2000PCS/Day

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine:

SHENZHEN CINA

Certificazione:

ISO 9001 ROHS SGS

Deformazione:

Massimo 0,2 mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Capacità:

10x10=100PZ

Materiale:

computer

Resistenza alla superficie:

1.0x10E4~1.0x10E11Ω

Dimensioni:

50,8x50,8x4 mm

Metodo di stampaggio:

Stampaggio ad iniezione

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Descrizione del prodotto

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

The "waffle" design is not merely a naming convention; the internal matrix of separator ribs functions as a high-precision structural grid that significantly increases the tray's mechanical rigidity. When multiple trays are stacked, these ribs align to create a series of reinforced vertical pillars, distributing external crushing forces across the entire stack rather than onto the fragile components within. Constructed from permanently conductive ABS or PC resins, these trays provide a dual layer of protection: safeguarding against electrostatic discharge (ESD) while providing a robust physical shield. By utilizing advanced Moldflow analysis, we ensure that the tray wall thickness and rib height are optimized for maximum strength-to-weight ratio. This ensures that your bare die, chip-scale packages (CSPs), and high-value 2.5D components remain securely seated and entirely isolated from external mechanical stress, ensuring they arrive at their destination in factory-perfect condition.

Key Features/ Benefits

Multi-Ribbed Structural Reinforcement
Impact-Absorbent Conductive Polymers
Permanent, Non-Degrading ESD Shielding
Precision Stackable Interlock System
Cleanroom-Compatible Purity

Specifications

Brand		Hiner-pack
Model		HN24130
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8x50.8x4mm
Cavity Size		1.75×1.2×0.35mm
Matrix QTY		10X10=100PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

This series is the industry standard for Cross-Border Semiconductor Distribution and secure component transit. Its primary applications include: International Shipping of Bare Die, where the risk of mechanical damage is highest; Logistics for High-Value Optoelectronics, providing a stable and crush-proof environment for fragile lenses; and Inter-Facility Component Transfer, where trays are moved between different manufacturing and testing sites. The robust design also makes them suitable for Field Service and Repair Kits, where replacement micro-parts must be carried safely in uncontrolled environments. Because they utilize the unofficial industry-standard 2-inch footprint, they integrate seamlessly into all global microelectronic supply chains, compatible with existing covers, clips, and automated handling interfaces.

Customization

We provide specialized engineering services to optimize our trays for your specific logistics challenges. Customization options include Reinforced External Wall Thickness for even higher crush resistance and Tailored Pocket Depths to accommodate thicker components while maintaining stack stability. Our team can also design Custom Stacking Configurations and specialized covers for non-standard heights. We offer a variety of material grades, including specific conductive colors for easy shipment identification. With a library of existing designs, we can rapidly find a structural match for your components, or we can develop a completely new mold in as little as 3 to 4 weeks, ensuring your global shipping needs are met with a precision-engineered solution.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tag:

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

Stackable Impact Resistant Conductive Waffle Pack Chip Trays For Fragile Component Shipping

JEDEC IC Chip Tray

Vassoi della matrice di rf JEDEC

Vassoi della matrice di IC JEDEC

Peso leggero di piccola dimensione degli anti ESD vassoi di plastica acidi riutilizzabili dell'OEM

Norma non tossica a 2 pollici di RoHS degli anti vassoi nudi statici del dado del nero dell'OEM

2 pollici quadrati portabile nero di plastica IC chip tray per dispositivi IC

Singola QFP alta qualità di spessore del vassoio 5.5mm del pacchetto della cialda dell'ABS