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Reusable Stackable JEDEC Tray with ESD Protection for Semiconductor IC Storage and Transport

Reusable Stackable JEDEC Tray with ESD Protection for Semiconductor IC Storage and Transport

Marchio: Hiner-pack
Numero di modello: HN24237
MOQ: 500 PZ
prezzo: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condizioni di pagamento: T/T
Capacità di approvvigionamento: 2000 pezzi/giorno
Informazioni dettagliate
Luogo di origine:
Cina
Certificazione:
ROHS, ISO
Tray Weight:
Varia, in genere fino a 500 grammi per cavità
Colore:
Solitamente nero o grigio scuro per la protezione ESD
Garanzia di qualità:
Garanzia di consegna, qualità affidabile
Dimensione della cavità:
30x22x2,3mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Tipo di muffa:
Iniezione
Riutilizzabile:
Forma del vassoio:
Rettangolare
Classe pulita:
Pulizia generale ed ultrasonica
Tipo IC:
BGA,QFP,QFN,LGA,PGA
Livello di imballaggio:
Pacchetto di trasporto
Planarità:
Meno di 0,76 mm
Capacità:
5x9=45 PZ
Imballaggi particolari:
cartone, pallet
Capacità di alimentazione:
2000 pezzi/giorno
Evidenziare:

JEDEC reusable semiconductor tray

,

IC tray for semiconductor logistics

,

JEDEC IC tray with warranty

Descrizione del prodotto
Reusable JEDEC Tray for Semiconductor Logistics

Designed for IC transport and storage, reducing packaging costs.

Key Features/ Benefits 
  • Reusable 
  • Cost-saving logistics solution
  • Stackable design
  • Durable material
Specifications
Brand Hiner-pack
Model  HN24237
Material  ABS
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 30x22x2.3 mm
Matrix QTY 5x9=45 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • IC shipping
  • Semiconductor storage
  • Fine pitch IC
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers