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Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Marchio:	Hiner-pack
Numero di modello:	HN25011
MOQ:	500 PZ
prezzo:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condizioni di pagamento:	T/T
Capacità di approvvigionamento:	2000 pezzi/giorno

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine:

Cina

Certificazione:

ROHS, ISO

Tray Weight:

Varia, in genere fino a 500 grammi per cavità

Colore:

Nero

Garanzia di qualità:

Garanzia di consegna, qualità affidabile

Dimensione della cavità:

322,6×135,9×7,62 millimetri

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo di muffa:

Iniezione

Riutilizzabile:

SÌ

Forma del vassoio:

Rettangolare

Classe pulita:

Pulizia generale ed ultrasonica

Tipo IC:

BGA,QFP,QFN,LGA,PGA

Livello di imballaggio:

Pacchetto di trasporto

Planarità:

Meno di 0,76 mm

Capacità:

20x9=180 PZ

Imballaggi particolari:

cartone, pallet

Capacità di alimentazione:

2000 pezzi/giorno

Descrizione del prodotto

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Guard delicate semiconductor wafers during production and handling. Sustain clean working environment and block dust particles effectively. Comply with JEDEC standards for reliable industrial use. Seeking trusted tray solutions for wafer packaging and storage?

Integrate seamlessly with automated assembly lines and packaging plants. Perform consistently in wafer transfer and packaging procedures. Adapt smoothly to diverse semiconductor manufacturing processes.

Facilitate safe storage and factory logistics of wafers. Support custom cavity designs to meet specific production demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.

Key Features/ Benefits

Strong durable structure
Effective dust prevention
Safeguard wafer packaging processes
Comply with JEDEC standards
Flexible customization

Specifications

Brand		Hiner-pack
Model		HN25011
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		8.5×8.5×0.9 mm
Matrix QTY		20x9=180 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer packaging, component testing, die sorting and semiconductor manufacturing. Fit cleanroom operations, automated assembly lines and packaging plants. Ensure stable performance in rigorous industrial environments.

Also used in wafer storage, factory logistics, production turnover and sample shipment. Serve semiconductor manufacturers, testing institutions and electronic component suppliers.

Customized Services

Offer comprehensive customization services for JEDEC IC trays. Collaborate closely with customers to analyze unique wafer specifications, production workflows, and environmental requirements. Modify cavity dimensions, grid layouts, material selections, and structural designs to perfectly match diverse wafer types and manufacturing scenarios. Provide end-to-end support from prototype testing to final production, delivering personalized tray solutions that enhance production efficiency, minimize contamination risks, and fully address specialized semiconductor manufacturing needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tag:

Vassoi di JEDEC IC

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IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

Durable JEDEC IC Trays for Clean Production and Wafer Dust Protection

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