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Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Marchio:	Hiner-pack
Numero di modello:	HN24198
MOQ:	500 PZ
prezzo:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condizioni di pagamento:	T/T
Capacità di approvvigionamento:	2000 pezzi/giorno

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine:

Cina

Certificazione:

ROHS, ISO

Tray Weight:

Varia, in genere fino a 500 grammi per cavità

Colore:

Nero

Garanzia di qualità:

Garanzia di consegna, qualità affidabile

Dimensioni della linea di contorno:

50,7×50,7×4 mm

Dimensione della cavità:

1,8x1,8x1,27mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo di muffa:

Iniezione

Riutilizzabile:

SÌ

Forma del vassoio:

Rettangolare

Classe pulita:

Pulizia generale ed ultrasonica

Tipo IC:

BGA,QFP,QFN,LGA,PGA

Livello di imballaggio:

Pacchetto di trasporto

Deformazione:

Deformazione MAX 0,26 mm

Capacità:

16x16=256 PZ

Imballaggi particolari:

cartone, pallet

Capacità di alimentazione:

2000 pezzi/giorno

Descrizione del prodotto

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Deliver precise grid-style waffle structure to securely hold fine pitch ICs, preventing component shifting and electrostatic damage during handling. Made of durable anti-static material to maintain stable performance in industrial settings, offering reliable protection for sensitive semiconductor devices.

Integrate smoothly with automated pick-and-place systems and clean manufacturing workflows, performing reliably in chip loading, transfer, and sorting procedures. Adapt flexibly to high-precision semiconductor production scenarios, boosting operational efficiency and component integrity.

Support full customization of cavity size, pitch, and layout to match unique fine pitch IC dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard delicate components throughout transit and long-term storage.

Key Features/ Benefits

Durable anti-static material
Offers stable cleanroom-grade contamination control
Stable component holding
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24198
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		1.8x1.8x1.27 mm
Matrix QTY		16x16=256 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support advanced semiconductor packaging, fine pitch die sorting, device testing, and precision component kitting operations. Pair seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments.

Also used for inter-plant component transfer, international shipping of sensitive fine pitch devices, and long-term inventory storage. Serve semiconductor fabs, advanced packaging facilities, and high-tech electronic component distributors.

Packaging & Shipping/ Services

Come in standard anti-static packaging to ensure product integrity during transit. Each tray is wrapped in protective film and placed in rigid cartons to prevent deformation and scratches.

Support bulk shipping via sea, air or express, with secure stacking to avoid damage during long-distance transportation. Ensure products arrive in good condition for immediate use in production.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tag:

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Vassoi di JEDEC IC

Vassoi della matrice di JEDEC

IC Chip Tray

Vassoi su ordinazione di JEDEC

Pacchetto Chip Trays della cialda

Vassoio dei componenti elettronici

Nudo muoiono i vassoi

Anti vassoi statici

Clip dei coperchi del pacchetto della cialda

Contenitore appiccicoso di gel

Scatola di spedizione del wafer

Cassetta di wafer metallici

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

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